3D Integration Director

? 3D Integration Program Director – Next-Gen Tech Leadership
? Belgium | Full-time | Employee Role

We’re partnering with a leading R&D powerhouse to find a 3D Integration Program Director—a newly created, high-impact role for a PhD-level expert ready to define the future of 3D IC technologies in AI, telecom, and semiconductor systems.

If you're looking for a blank canvas with executive support to build something groundbreaking—this is it.

What You’ll Do:

• Define and lead the strategy for 3D integration within the global R&D framework.

• Shape the roadmap for chip-to-chip integration, advanced packaging, and heterogeneous systems.

• Scout innovation in AI/CPU, telecom, and HPC, and turn tech concepts into commercial breakthroughs.

• Coordinate cross-functional teams across research, supply chain, and manufacturing.

• Establish a new team as the program grows—this starts with you.

What You Bring:

• PhD in Engineering, Materials Science, or related field.

• 10+ years in 3D IC, semiconductor packaging, or integration technologies.

• Proven ability to drive complex R&D programs with technical and strategic oversight.

• Experience in CAD tools, simulation, and testing platforms for chip design/integration.

• Strong leadership and communication skills in cross-cultural, multi-stakeholder environments.

Why This Role?

• This isn’t an operational handover—it’s a strategic build-up from scratch.

• You’ll set the direction for a core research pillar aligned with next-gen AI and 5G systems.

• Backed by senior leadership, you'll influence high-level R&D investments and future product strategy.

Ready to define what's next in 3D integration?
Apply now and lead a high-stakes, high-visibility program from day one.