3D Integration Director
8378
Posted: 03/04/2025
- Per Day Competitive
- Belgium
- Telecoms & Data Centre
- Permanent
3D Integration Program Director – R&D
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A leading European research institute is looking for a 3D Integration Program Director to drive groundbreaking advancements in 3D IC, chip stacking, and heterogeneous integration for AI, telecom, and high-performance computing.
The Role
- Define and lead a new 3D integration program from the ground up.
- Spearhead high-impact AI/CPU and telecom R&D projects.
- Translate cutting-edge research into commercial breakthroughs.
- Collaborate with global industry leaders to shape the future of 5G, AI, and semiconductor tech.
- Build and expand a team of experts in 3D integration and semiconductor R&D.
What You Bring
- PhD in Engineering, Materials Science, or related field.
- 10+ years of experience in 3D IC, semiconductor packaging, and advanced materials.
- Expertise in heterogeneous integration, MEMS, and chip-to-chip technologies.
- Strategic mindset with strong leadership and project management skills
Catherine Udell
Principal Account Manager