Senior Packaging Strategist Leader | Semiconductor Manufacturing

Our client is a global leader in semiconductor technology, specializing in advanced power packaging solutions for high-performance applications. They are committed to cutting-edge R&D, innovation, and enabling next-generation power module technologies for diverse markets.

To support their growing packaging and system-level integration initiatives, they are seeking a Senior Packaging Platform Technical Leader based in the USA. This role will play a critical part in shaping packaging roadmaps, customer engagement strategies, and cross-functional development efforts.

Key Responsibilities

• Drive the transition from traditional packaging to a system-level, application-driven approach for power modules.
• Define and prioritize packaging technology roadmaps for discrete and module power packaging solutions, in collaboration with business units and key customers.
• Act as the primary US-based packaging interface for strategic package development programs, coordinating global packaging teams.
• Lead problem-solving initiatives, escalate critical outcomes to executive leadership, and ensure alignment with corporate objectives.
• Organize and report on weekly, monthly, and quarterly KPIs, identifying gaps and improvement areas.

Leadership & Communication

• Communicate technical vision, value proposition, and roadmap effectively to both technical and executive stakeholders.
• Present and articulate technical risks, opportunities, and program progress to senior management.
• Work collaboratively in high-performance, cross-functional teams, both in direct and matrixed relationships.
• Build and maintain strong customer relationships, managing expectations and resolving issues proactively.
• Adapt to changing priorities with a flexible yet execution-focused mindset.
• Identify risks early, propose creative solutions, and drive strategic problem-solving initiatives.

Qualifications & Experience

• Master’s degree in Material Science, Global Engineering, Mechanical Engineering, or a related field.
• At least 15 years of experience in power packaging development, with a proven track record in complex semiconductor packaging.
• Experience in technical team leadership and customer relationship management.
• Strong cross-cultural understanding and ability to collaborate with global teams.
• Expertise in strategy definition, roadmap execution, and project management from concept to full production release.
• Strong understanding of design, process, and equipment dependencies in semiconductor packaging.
• Proficiency in risk management, problem-solving methodologies, and robust design principles.
• Business acumen with the ability to align technical development with commercial objectives.

What the Company Offers

• Opportunity to lead strategic packaging development for next-generation power modules.
• A collaborative and innovation-driven environment with leading experts in semiconductor packaging.
• Competitive salary and comprehensive benefits package.
• Career growth opportunities within a global leader in power semiconductor technology.

For more details or to apply, please reach out for a confidential discussion.